001 -Identificacion Principal del registro
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Identificacion Principal del registro
INGC-EBK-000066
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003 -Control Number Identifier
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Control Number Identifier
AR-LpUFI
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005 -LAST MODIFICATION DATE
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LAST MODIFICATION DATE
20160826095734
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007 -CONTROL FIELD
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CONTROL FIELD
cr nn 008mamaa
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008 -CONTROL FIELD
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CONTROL FIELD
131008s2014 xxu| s |||| 0|eng d
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020 -INTERNATIONAL STANDARD BOOK NUMBER
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a
International Standard Book Number
9781461442745
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024 -OTHER STANDARD IDENTIFIER
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a
Standard number or code
10.1007/978-1-4614-4274-5
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100 -MAIN ENTRY--PERSONAL NAME
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a
Personal name
Tatas, Konstantinos.
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245 -TITLE STATEMENT
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a
Title
Designing 2D and 3D Network-on-Chip Architectures
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h
Medium
[libro electrónico] /
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c
Statement of responsibility, etc
by Konstantinos Tatas, Kostas Siozios, Dimitrios Soudris, Axel Jantsch.
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260 -PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
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a
Place of publication, distribution, etc
New York, NY :
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b
Name of publisher, distributor, etc
Springer New York :
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b
Name of publisher, distributor, etc
Imprint: Springer,
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c
Date of publication, distribution, etc
2014.
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300 -PHYSICAL DESCRIPTION
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a
Extent
xiii, 265 p. :
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b
Other physical details
il.
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505 -FORMATTED CONTENTS NOTE
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a
Formatted contents note
Part I: Network-on-Chip Design Methodology -- Network-on-Chip Technology: A Paradigm Shift -- NoC Modeling and Topology Exploration -- Communication Architecture -- Power and Thermal Effects and Management -- NoC-based System Integration -- NoC Verification and Testing -- The Spidergon STNoC -- Middleware Memory Management in NoC -- On Designing 3-D Platforms -- The SYSMANTIC NoC Design and Prototyping Framework -- Part II: Suggested Projects.-Â Projects on Network-on Chip.
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520 -SUMMARY, ETC.
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a
Summary, etc
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. ·        Describes essential theory, practice and state-of-the-art applications of 2D and 3D Network-on-Chip interconnect; ·        Enables readers to exploit parallelism in processor architecture, with interconnect design that is efficient in terms of energy and performance; ·        Covers topics not available in other books, such as NoC and distributed memory organization, dynamic memory management and abstract data type support in many-core platforms, and distributed hierarchical power management.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Engineering.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Microprocessors.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Electronics.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Microelectronics.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Electronic circuits.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Circuits and Systems.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Instrumentation.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Processor Architectures.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Siozios, Kostas.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Soudris, Dimitrios.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Jantsch, Axel.
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856 -ELECTRONIC LOCATION AND ACCESS
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u
Uniform Resource Identifier (R)
http://dx.doi.org/10.1007/978-1-4614-4274-5
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942 -Biblioitem information
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929 -Medio de adquisicion
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