001 -Identificacion Principal del registro
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Identificacion Principal del registro
INGC-EBK-000075
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003 -Control Number Identifier
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Control Number Identifier
AR-LpUFI
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005 -LAST MODIFICATION DATE
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LAST MODIFICATION DATE
20160826100336
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007 -CONTROL FIELD
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CONTROL FIELD
cr nn 008mamaa
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008 -CONTROL FIELD
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CONTROL FIELD
130919s2014 xxu| s |||| 0|eng d
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020 -INTERNATIONAL STANDARD BOOK NUMBER
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a
International Standard Book Number
9781461457619
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024 -OTHER STANDARD IDENTIFIER
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a
Standard number or code
10.1007/978-1-4614-5761-9
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100 -MAIN ENTRY--PERSONAL NAME
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a
Personal name
Chauhan, Preeti S.
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245 -TITLE STATEMENT
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a
Title
Copper Wire Bonding
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h
Medium
[libro electrónico] /
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c
Statement of responsibility, etc
by Preeti S Chauhan...[et al.].
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260 -PUBLICATION, DISTRIBUTION, ETC. (IMPRINT)
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a
Place of publication, distribution, etc
New York, NY :
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b
Name of publisher, distributor, etc
Springer New York :
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b
Name of publisher, distributor, etc
Imprint: Springer,
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c
Date of publication, distribution, etc
2014.
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300 -PHYSICAL DESCRIPTION
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a
Extent
xxvi, 235 p. :
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b
Other physical details
il.
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505 -FORMATTED CONTENTS NOTE
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a
Formatted contents note
Copper Wire Bonding -- Bonding Process -- Bonding Metallurgies -- Wire Bond Evaluation -- Thermal Reliability Tests -- Humidity and Electromigration Tests -- Wire Bond Pads -- Concerns and Solutions -- Recommendations -- Appendix A: Reliability Data -- Appendix B: Patents on Copper Wire Bonding.
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520 -SUMMARY, ETC.
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a
Summary, etc
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks.  Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material.  However, copper wire bonding has several process and reliability concerns due to its material properties.  Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changesâ_"bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation.  In addition, the bondâ_"pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed.  The book also discusses best practices and recommendations on the bond process, bondâ_"pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bondâ_"pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry  Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Engineering.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Mechatronics.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Industrial engineering.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Optical materials.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Electronic materials.
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650 -SUBJECT ADDED ENTRY--TOPICAL TERM
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a
Topical term or geographic name as entry element
Operating Procedures, Materials Treatment.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Choubey, Anupam.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Zhong, ZhaoWei.
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700 -ADDED ENTRY--PERSONAL NAME
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a
Personal name
Pecht, Michael G.
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856 -ELECTRONIC LOCATION AND ACCESS
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u
Uniform Resource Identifier (R)
http://dx.doi.org/10.1007/978-1-4614-5761-9
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942 -Biblioitem information
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929 -Medio de adquisicion
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